Principal PCB/A Materials & Process Engineer

Radar Reinvented. Echodyne offers the world’s first compact solid-state true beam-steering radar for a wide range of industries and applications. Our high-performance radars work in all weather and are designed for autonomous vehicles, uncrewed aircraft & drones, and security of borders, critical infrastructure, and smart cities. The company combines the patented technology of metamaterials with powerful software to create a radar sensor with unprecedented performance at commercial price points. Echodyne offers its radars to companies working in Automotive, Transportation, Critical Infrastructure Protection, Border Security, Smart Cities, Uncrewed Aircraft Systems (UAS), and Airspace Management including Urban Air Mobility (UTM). Echodyne is seeking a Principal PCB/A Materials & Process Engineer to join our fast-growing team. ROLE OVERVIEW Echodyne is seeking a Principal PCB/A Materials & Process Engineer with strong expertise in printed circuit board materials, fabrication processes, and electronics assembly processes to support the development and production of high-performance commercial radar products. At the foundation of every Echodyne radar is a printed circuit board assembly that must deliver RF, high-speed digital, thermal, mechanical, and manufacturing performance within a producible design. In this role, you will serve as a subject matter expert for PCB materials and fabrication processes, while also applying strong working knowledge of PCBA assembly processes to help bring new products to market and improve supplier capability across the product lifecycle. This role will work primarily in new product development, partnering with design engineering, program management, operations, supply chain, and suppliers to ensure that new PCB and PCBA designs are aligned with capable, scalable, and reliable manufacturing processes. You will also support production supplier development where new or improved supplier capabilities are required to support released products, cost reduction, yield improvement, reliability, or manufacturability needs. RESPONSIBILITIES Serve as the technical authority in development for PCB materials, stackups, fabrication processes, and manufacturability tradeoffs for complex RF, high-speed, and mixed-signal designs Partner with design engineering, program management, operations, supply chain, and suppliers during NPI to align product requirements with practical PCB and PCBA manufacturing capabilities Lead technical engagement with PCB fabricators, material suppliers, and electronics manufacturing suppliers to assess advanced or emerging materials, new fabrication capabilities and processes, identify and resolve process gaps, and support supplier development Support supplier selection, qualification builds, production readiness, yield improvement, and root-cause analysis related to PCB fabrication, PCB materials, and PCBA manufacturing processes before production release Provide practical…