RF Engineer

ABOUT US QuantWare is building the world’s most powerful quantum processors to solve humanity's greatest challenges. We do this with our unique VIO™ technology, the only QPU architecture that breaks the hardware barriers that have held quantum computing back, unlocking the path to MegaQubit quantum processors. With VIO, we are paving the way for the hyper-scale quantum computers that will change the world. And delivering on that vision demands people who don’t shy away from tackling the hardest challenges of our time. That’s where you come in! Join us as a RF Design Engineer to drive the physical realization of our next-generation 3D quantum hardware architecture. You will own the design of critical microwave components, create high-density PCB layouts, and build novel packaging solutions for large-scale QPUs. Working at the intersection of hardware and software, you'll also help streamline our development by embedding design processes into automated workflows. WHAT YOU'LL BE DOING - Component & Mechanical Design: Design critical electromechanical components that form the backbone of our QPUs. You will work closely with the simulation team to validate models and implement design improvements at both the chip and board levels. - Precision Engineering: Utilise CAD to design PCBs, silicon chip layout and PCB-to-chip interconnect within the vertical VIO architecture - RF/Microwave Design: Solve complex challenges related to insertion loss, impedance matching, and cross-talk at both the PCB and package levels. - Automation & Scripting: Integrate designs into our codebase. You will create Python scripts to automate design generation and implement Design Rule Checks to ensure every component is correct and manufacturable. YOUR PROFILE - Education: MSc or PhD in Electrical Engineering with a focus on RF/Microwave Engineering. - Experience: 4+ years of hands-on RF engineering experience in deep-tech or low-volume hardware environments. - Core RF Fundamentals: Solid understanding of RF link budget calculations, S-parameters, complex impedance analysis, Smith Chart, and matching network design. - 3D EM Simulation: Proven experience with full-wave 3D electromagnetic solvers (e.g., Ansys HFSS, Q3D). - RF Characterization: Practical experience with RF testing and measurements using VNA and related laboratory equipment. Nice to Have: - Circuit Design: Practical experience designing circuit-level components, such as filters, couplers, and attenuators. - Packaging & Interconnects: Background in high-density interconnects, high frequency flex interconnects, 3D packaging, or advanced integration. - Domain Knowledge: Familiarity with superconducting technologies is a strong plus. - PCB Layouting: Proficient in PCB layout design, utilizing tools such as KiCAD, Altium Designer, and Cadence to deliver high-quality board designs. Don't tick every box? Apply anyway! Research…