Senior IC Substrate Package Layout Designer

Responsibilities We are looking for an experienced Senior IC Substrate Package Layout Designer to lead advanced semiconductor package development from die netlist analysis, bump feasibility and package planning through substrate layout, SI/PI optimization, and manufacturing release. The role requires close collaboration with Backend/Physical Design, SI/PI, Assembly, Reliability, and Manufacturing teams to deliver high-performance package solutions for complex SoCs and multi-die products. You will focus on: Own complete package design activities including die bump planning, pin assignment, floorplanning, package routing, stackup definition, and package signoff Perform bump feasibility studies and optimize package architecture for routability, SI/PI performance, manufacturability, reliability, and cost Design and implement substrates for FCCSP, HFCBGA/FCBGA, Leadframe, Multi-Chip Modules (MCM), SiP, Interposer, Chiplet-based and advanced 2.5D/3D packages Collaborate closely with Backend, SI/PI, Thermal, Assembly, OSAT, and substrate vendors to resolve design and manufacturing challenges Support package verification, design reviews, and tape-out activities while ensuring compliance with technology and assembly requirements Qualifications Bachelor's or Master's degree in Electrical/Electronics Engineering or related field 4+ years of experience in IC package/substrate layout design Expert-level proficiency in Cadence Allegro Package Designer (APD/APD XL), SiP Layout, and Constraint Manager Strong understanding of substrate stackups, material selection, HDI technologies, via structures, package assembly processes, and reliability considerations Working knowledge of Signal Integrity, Power Integrity, impedance control, differential routing, PDN design, return path optimization, and crosstalk management Hands-on experience with high-speed interfaces including SerDes, PAM4, PCIe, DDR/LPDDR, HBM, Ethernet, CXL, USB, UCIe, and other multi-gigabit interfaces Preferred Qualifications Experience with AI/HPC, Networking, Data Center, or High-Performance Computing products Knowledge of advanced packaging technologies such as Chiplets, Silicon Interposers, CoWoS, EMIB, and 3D Integration Automation and scripting skills (Python, TCL, SKILL, or Perl) Proven ability to lead complex package programs and mentor junior designers The ideal candidate should be capable of independently driving package design from concept to production while balancing performance, manufacturability, reliability, and cost objectives. Company Overview MaxLinear is a global, NASDAQ-traded company (MXL) where the entrepreneurial spirit is alive and well. We are a fabless system-on-chip product company, striving to improve the world’s communication networks for everyone through our highly integrated radio-frequency (RF), analog, digital, and mixed-signal semiconductor solutions for access and connectivity, wired and wireless infrastructure, and…