Technician III - Failure Analysis

Are you looking for a unique opportunity to be a part of something great? Want to join a 17,000-member team that works on the technology that powers the world around us? Looking for an atmosphere of trust, empowerment, respect, diversity, and communication? How about an opportunity to own a piece of a multi-billion dollar (with a B!) global organization? We offer all that and more at Microchip Technology Inc. People come to work at Microchip because we help design the technology that runs the world. They stay because our culture supports their growth and stability. They are challenged and driven by an incredible array of products and solutions with unlimited career potential. Microchip’s nationally-recognized Leadership Passage Programs support career growth where we proudly enroll over a thousand people annually. We take pride in our commitment to employee development, values-based decision making, and strong sense of community, driven by our Vision, Mission, and 11 Guiding Values ; we affectionately refer to it as the Aggregate System and it’s won us countless awards for diversity and workplace excellence. Our company is built by dedicated team players who love to challenge the status quo; we did not achieve record revenue and over 30 years of quarterly profitability without a great team dedicated to empowering innovation. People like you. Visit our careers page to see what exciting opportunities and company perks await! Job Description: A failure analysis technician is responsible in providing failure analysis to support customer returns, qualifications, and other engineering evaluations. Collaboration with FA requestors and other cross-functional teams is also required. He/she must observe proper housekeeping, environmental, health, and safety protocols while doing his/her tasks. 1.     Support customer returns, qualifications, and other engineering evaluations that require failure analysis. 2.     Perform non-destructive analysis such as optical visual inspection, x-ray, and scanning acoustic microscopy. 3.     Perform destructive analysis such as soldering/desoldering, lead conditioning, deballing/reballing, mechanical/chemical decapsulation, package/die level deprocessing, cross-sectioning, and other FA techniques available in the laboratory. 4.     Conduct material analysis such as SEM/EDX, cross-sectioning, wire bond mechanical testing and other material analysis capabilities that the FA lab may acquire in the future. 5.     Perform competent electrical verification using curve tracer and/or basic bench tools. Perform competent application board testing with minimal guidance . 6.     Perform competent visual/mechanical package level failure analysis with minimal guidance . 7.     Perform competent open/short and parametric full failure analysis with minimal guidance . 8.     Perform competent fault isolation with minimal guidance . 9.     Perform competent die level physical failure analysis procedures…